File:3DS die stacking concept model.PNG

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	09:16, 11 November 2011		1,000 × 440 (65 KB)	Shigeru23	3DS die stacking concept model<br /> Made by uploader (ref:[http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに])<br /> Upload Date:2011-11-11<br /> [[Cate

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