Pin grid array
Pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are typically made of a conductive material such as gold or copper and are used to connect the integrated circuit to a printed circuit board (PCB) or a socket.
Design and Structure[edit | edit source]
The pin grid array design allows for a high density of pins, which can be beneficial for complex integrated circuits that require many connections. The pins are usually spaced at a standard pitch, such as 2.54 mm (0.1 inches), which allows for compatibility with standard sockets and PCBs.
Types of PGA[edit | edit source]
There are several types of PGA packages, including:
- Ceramic Pin Grid Array (CPGA): Made from ceramic materials, offering high thermal conductivity and mechanical strength.
- Plastic Pin Grid Array (PPGA): Made from plastic materials, typically used for lower-cost applications.
- Flip-Chip Pin Grid Array (FCPGA): A type of PGA where the die is flipped and bonded directly to the package, improving electrical performance and heat dissipation.
Applications[edit | edit source]
PGA packages are commonly used in microprocessors, microcontrollers, and other high-performance integrated circuits. They are favored in applications where reliable and robust connections are required, and where the integrated circuit may need to be replaced or upgraded.
Advantages and Disadvantages[edit | edit source]
Advantages[edit | edit source]
- High pin density allows for complex and high-performance integrated circuits.
- Reliable and robust connections.
- Easy to replace or upgrade the integrated circuit.
Disadvantages[edit | edit source]
- The large number of pins can make the package more susceptible to damage during handling.
- Requires precise alignment when inserting into a socket or PCB.
Related Technologies[edit | edit source]
- Ball grid array (BGA)
- Land grid array (LGA)
- Dual in-line package (DIP)
- Surface-mount technology (SMT)
See Also[edit | edit source]
References[edit | edit source]
External Links[edit | edit source]
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